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Specification:Item Type: Tin Planting PlatformMaterial: Steel MeshModel: DS 201BProduct Function: For OS Laptop planting tin platform, mainly used for small BGA chip product functions (including PMU, SMC, T1, T2, RAM, NAND, WIFI, Power Chip)A1534 16 17 CPU: A1534 16 models 17 models CPU chip steel meshSR2NH PCH: 6th generation 7th generation PCH south bridge chip steel meshCD3217B CD3215 R4F2113 L FXP 2 Chip steel meshT1 Chip: T1 Chip steel meshMemory Chips Platform1-8: DDR3 memory, LPDDR3 memory, DDR4 memory, GDDR 5 memory1 ND GEN T2: 1st generation T2 chip stencil2 ND GEN T2: 2nd generation T2 chip stencil10-11, 12-15, 16-17SMC: 10-17 SMC chip steel meshSN 6 50801, SN650811, JHL8040R, 4208 CRZ, L FW643E Chip Stencil For OS Laptop A15342015BGA Chips StencilFor OS Laptop A 15342016-2017BGA ChipsMACSSD NAND DDR ChipsFor OS Laptop BGA ChipsMacBookPro A1706/1707 BGA ChipsFor OS X WIFI ChipsFor OS X SDD Master ChipsFor OS Laptop Pro A2159 BGA ChipsT2 PMU SMC SSD Control ChipsHow to Use:Take it out and use itPackage List:11 x Steel Mesh15 x Steel Mesh Holder Assembly2 x Magnet Base
2 Magnetic Bases: Complete supporting facilities, equipped with 2 magnetic bases, super magnetic, easy to operate and high efficiency.
Excellent Performance: Has excellent performance, anti magnetic, anti static, good toughness, strong wear resistance.
Easy Hanging Tin: With ceramic tin planting knife, rectangular flat wire processing, easy hanging tin.
Accurate Hole Position: The steel mesh is accurate and durable, the hole position is accurate, and there is no need for secondary positioning.
Tin Planting Platform: For OS Laptop tin planting platform, mainly used for tin planting of small BGA chip products (including PMU, SMC, T1, T2, RAM, NAND, WIFI, Power Chip).
